The Characteristics, Structure And Application Of Aluminum Substrate

The Characteristics Of Aluminum Substrate

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1. Surface mount technology (SMT) is adopted;
2. Very effective treatment of heat diffusion in circuit design;
3. Reduce the operating temperature of the product, improve the power density and reliability of the product, and prolong the service life of the product;
4. Reduce product volume and reduce hardware and assembly costs;
5. Replace the fragile ceramic substrate to obtain better mechanical durability.

The Structure Of PCB Aluminum Substrate

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PCB aluminum based copper clad laminate is a kind of metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:

• Cireuitl. Layer circuit layer: copper clad laminate equivalent to ordinary PCB, and the thickness of circuit copper foil is LOZ to 10oz.
• Dielcctric layer: the insulating layer is a layer of low thermal resistance and heat conduction insulating material. Thickness: 0.003 “to 0.006” inch, which is the core technology of aluminum based copper clad laminate and has obtained UL certification.
• Base layer: it is a metal substrate, generally aluminum or optional copper. Aluminum based copper clad laminate and traditional epoxy glass cloth laminate.

PCB aluminum substrate is composed of circuit layer, thermal insulation layer and metal base layer. The circuit layer (i.e. copper foil) is usually etched to form a printed circuit to connect the components. Generally, the circuit layer is required to have great current carrying capacity, so a thicker copper foil with a thickness of 35 should be used μ m~280 μ m； Thermal insulation layer is the core technology of PCB aluminum substrate. It is generally composed of special polymers filled with special ceramics. It has small thermal resistance, excellent viscoelastic performance, anti-aging ability and can withstand mechanical and thermal stress. This technology is used in the thermal insulation layer of high-performance PCB aluminum substrates such as t-101, t-111, t-112, t-113, t-114, t-200, t-300, T-400, T-500 and T-600, which makes it have extremely excellent thermal conductivity and high-strength electrical insulation performance; The metal base layer is the supporting component of aluminum substrate, which requires high thermal conductivity. It is generally aluminum plate, and copper plate can also be used (copper plate can provide better thermal conductivity), which is suitable for conventional machining such as drilling, punching, shearing and cutting. Compared with other materials, PCB has incomparable advantages. Suitable for SMT public art of surface mounting of power components. Without radiator, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good.

The Application Of PCB Aluminum Substrate

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1. Audio equipment: input and output amplifiers, balance amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
2. Power supply equipment: switch regulator ` DC / AC converter ` SW regulator, etc.
3. Communication electronic equipment: high frequency amplifier ` filter electric appliance ` transmitting circuit.
4. Office automation equipment: motor driver, etc.
5. Automobile: electronic regulator, igniter, power controller, etc.
6. Computer: CPU board, floppy disk drive, power supply device, etc.
7. Power module: converter, solid relay, rectifier bridge, etc.
8. Lamp decoration: with the promotion of energy-saving lamps, the aluminum substrate applied to LED lamps has also begun to be applied on a large scale.

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