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The Appeared Problems Of Aluminum Alloy Welding Process

Strong Oxidation Capacity The affinity between aluminum and oxygen is very strong. It is easy to combine with oxygen in the air to form a dense and solid Al2O3 film with a thickness of about 0.1 μ m. The melting point is as high as 2050 ℃, far exceeding the melting point of aluminum and aluminum alloys, and the density is very large, about 1.4 times that of aluminum. In the welding process, alumina film will hinder the good bonding between metals and easily cause slag inclusion. The oxide film will also absorb water, which will promote the formation of pores in the weld during welding. These defects will reduce Read more

Traditional Aluminum And Aluminum Alloy Electroplating

After electroplating various metals on the surface of aluminum and aluminum alloy, the physical or chemical properties of the surface can be significantly improved. When aluminum and aluminum alloy are used as conductors, electroplating silver on the surface can improve the conductivity of the surface or electrical contact part; In order to make aluminum easy to weld, copper, nickel or tin are electroplated on its surface; In order to improve its wear resistance, thick chrome is electroplated on its surface. In terms of decoration, most of them are actually electroplated. Electroplating on the surface of aluminum and aluminum alloy has been tried for a long time and has been used Read more

The Characteristics, Structure And Application Of Aluminum Substrate

The Characteristics Of Aluminum Substrate Surface mount technology (SMT) is adopted; Very effective treatment of heat diffusion in circuit design; Reduce the operating temperature of the product, improve the power density and reliability of the product, and prolong the service life of the product; Reduce product volume and reduce hardware and assembly costs; Replace the fragile ceramic substrate to obtain better mechanical durability. The Structure Of PCB Aluminum Substrate PCB aluminum based copper clad laminate is a kind of metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers: Cireuitl. Layer circuit layer: copper clad laminate equivalent Read more