The Characteristics Of Aluminum Substrate Surface mount technology (SMT) is adopted; Very effective treatment of heat diffusion in circuit design; Reduce the operating temperature of the product, improve the power density and reliability of the product, and prolong the service life of the product; Reduce product volume and reduce hardware and assembly costs; Replace the fragile ceramic substrate to obtain better mechanical durability. The Structure Of PCB Aluminum Substrate PCB aluminum based copper clad laminate is a kind of metal circuit board material, which is composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers: Cireuitl. Layer circuit layer: copper clad laminate equivalent Read more